A study of laser jet soldering process with 55 μm tin balls for head gimbal assembly manufacturing
This paper presented a study of the laser jet soldering process based on 55 μm tin balls. In the tin ball-based laser jet soldering, the N2 pressure should be increased and the laser energy value should be decreased as the diameter of the tin ball decreased. Moreover, the distribution of laser energy significantly affected soldering quality. Through using DoE methodology, the optimized parameters for laser jet soldering based on 55 μm tin balls were obtained. To eliminate the increasing of dispersity of the pitch static angle (PSA) caused by soldering micro-deformation, an optimized soldering sequence and two additional supports on tongue piece were taken. Volume production showed that the proposed laser jet soldering process based on 55 μm tin balls can manufacture HGA products with a qualification ratio of approximately 99.3%.