RESIDUAL STRESS IN A THIN-FILM MICROOPTOELECTROMECHANICAL (MOEMS) MEMBRANE

K. Malinauskas, V. Ostaševičius, R. Daukševičius, V. Grigaliūnas

Abstract


Residual stress from the thin film deposition process can have extremely important effects on the functionality and reliability of MOEMS devices. Almost all surface-micromachined thin films are subject to residual stresses. The most common is thermal stress, which accompanies a change in temperature when thin-film is evaporated on substrate and when it cools down to room temperature. This paper presents the surface-micro-machined micromembrane micromachining technology. The principle scheme of the object is presented and working principle of micromembrane is described. Furthermore, using powerful modeling software Comsol Multiphysics comparison of eigenfrequencies of structure with thermal stresses and without it is presented. A possible problem solution will also be included.

DOI: http://dx.doi.org/10.5755/j01.mech.18.3.1880


Keywords


MOEMS; Residual stresses; thermal stress; eigenfrequencies with and without residual stresses

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Print ISSN: 1392-1207
Online ISSN: 2029-6983