RESIDUAL STRESS IN A THIN-FILM MICROOPTOELECTROMECHANICAL (MOEMS) MEMBRANE

Authors

  • K. Malinauskas Kaunas University of Technology
  • V. Ostaševičius Kaunas University of Technology
  • R. Daukševičius Kaunas University of Technology
  • V. Grigaliūnas Kaunas University of Technology

DOI:

https://doi.org/10.5755/j01.mech.18.3.1880

Keywords:

MOEMS, Residual stresses, thermal stress, eigenfrequencies with and without residual stresses

Abstract

Residual stress from the thin film deposition process can have extremely important effects on the functionality and reliability of MOEMS devices. Almost all surface-micromachined thin films are subject to residual stresses. The most common is thermal stress, which accompanies a change in temperature when thin-film is evaporated on substrate and when it cools down to room temperature. This paper presents the surface-micro-machined micromembrane micromachining technology. The principle scheme of the object is presented and working principle of micromembrane is described. Furthermore, using powerful modeling software Comsol Multiphysics comparison of eigenfrequencies of structure with thermal stresses and without it is presented. A possible problem solution will also be included.

DOI: http://dx.doi.org/10.5755/j01.mech.18.3.1880

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Published

2012-06-14

Issue

Vol. 18 No. 3 (2012)

Section

MECHANICS OF SOLID BODIES

License

The copyright for the articles in this journal is retained by the author(s) with the first publication right granted to the journal. The journal is licensed under the Creative Commons Attribution License 4.0 (CC BY 4.0).