Thick Plate Bending and Image Processing Algorithms Assistant for Deformation Process Discretization Analyses

Abstract

The mechanism of three-point thick plate bending finished via the specially designed experiment device in this paper. The deformation process discretization analysis completed via gridding method. T2 copper thick plate was chosen as the subject for the experiment, and the ratio of punch radius to sheet thickness was R/t = 1 and 2. The surface of the specimen was meshed by use of fine ink pen. The forming process was accomplished on the experimental facility of three-point free of sheet metal bending. And photos of the specimen in the forming process were recorded on every moment by use of digital camera. The grid pictures of specimen were gotten by image processing, and the accuracy is comparable with finite element analysis.  Compared with the grid pictures, the inside and outside of the thick plate bending angle wasn’t strict equaled in the forming process, and there was a trend that the angle would increase gradually from inside to outside. The angle difference would be decreased under the effect of the correction force after spring-back.